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High-temperature polyimide nanofoams for microelectronic applications

✍ Scribed by J.L. Hedrick; K.R. Carter; H.J. Cha; C.J. Hawker; R.A. DiPietro; J.W. Labadie; R.D. Miller; T.P. Russell; M.I. Sanchez; W. Volksen; D.Y. Yoon; David Mecerreyes; R. Jerome; James E. McGrath

Book ID
108046783
Publisher
Elsevier Science
Year
1996
Tongue
English
Weight
951 KB
Volume
30
Category
Article
ISSN
1381-5148

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Polyimides are finding increased applications in microelectronics due to their high thermal stability, good chemical resistance, good adhesion, low moisture absorption, good mechanical properties, and low coefficient of thermal expansion (CTE). Four series of random copolyimides were synthesized and