Dimensionally stable polyimide copolymer
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Catharine C. Fay; Anne K. St. Clair
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Article
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1998
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John Wiley and Sons
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English
β 157 KB
Polyimides are finding increased applications in microelectronics due to their high thermal stability, good chemical resistance, good adhesion, low moisture absorption, good mechanical properties, and low coefficient of thermal expansion (CTE). Four series of random copolyimides were synthesized and