๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

High-purity refractory metals and silicides for microelectronic applications

โœ Scribed by R. Huenert; G. Winter; W. Kiliani; D. Greifendorf


Book ID
113302721
Publisher
Elsevier Science
Year
1992
Tongue
English
Weight
584 KB
Volume
11
Category
Article
ISSN
0263-4368

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๐Ÿ“œ SIMILAR VOLUMES


Defect Control in High Purity Metals for
โœ Gilman, P. S. ๐Ÿ“‚ Article ๐Ÿ“… 1998 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 458 KB

Metal purity for interconnect applications deposited by physical vapor deposition has steadily improved ot the point where 5N5 purity for aluminum alloys is routinely exceeded, while for titanium metal purity is at 5N and progressing to 6N. However, recent industrial experience indicates that metal