𝔖 Bobbio Scriptorium
✦   LIBER   ✦

High-speed VLSI interconnect modeling based on S-parameter measurements

✍ Scribed by Eo, Y.; Eisenstadt, W.R.


Book ID
114560472
Publisher
IEEE
Year
1993
Tongue
English
Weight
624 KB
Volume
16
Category
Article
ISSN
0148-6411

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES


RF equivalent-circuit model of interconn
✍ Xiaomeng Shi; Jianguo Ma; Beng Hwee Ong; Kiat Seng Yeo; Manh Anh Do; Erping Li πŸ“‚ Article πŸ“… 2005 πŸ› John Wiley and Sons 🌐 English βš– 289 KB

## Abstract A modified model for RF interconnect bends on lossy substrate in CMOS technology is presented. The model parameters are extracted directly from the on‐wafer S‐parameter measurements. The accuracy is verified up to 20 GHz by the measurements of the test structures. Β© 2005 Wiley Periodica