High-speed VLSI interconnect modelling based on s-parameter measurements : Yungseon Eo and William R. Eisenstadt. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(5), 555 (August 1993)

• Book ID: 103283157
• Publisher: Elsevier Science
• Year: 1994
• Tongue: English
• Weight: 111 KB
• Volume: 34
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(94)90382-4