๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

High Pinout IC Packaging and the Density Advantage of Surface Mounting

โœ Scribed by Knausenberger, W.; Teneketges, N.

Book ID
117911480
Publisher
IEEE
Year
1983
Tongue
English
Weight
739 KB
Volume
6
Category
Article
ISSN
0148-6411

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Wire density in CAE analysis of high pin
Wire density in CAE analysis of high pin-count IC packages: Simulation and verification
โœ W.R. Jong; Y.R. Chen; T.H. Kuo ๐Ÿ“‚ Article ๐Ÿ“… 2005 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 907 KB

Wire sweep has been recognized as one of the major defects in the encapsulation of microelectronic chips by the transfer molding process. As thinner and denser IC packages emerge, wire-sweep analysis becomes more challenging and troublesome. This paper studies the reactive flow in IC encapsulation