High pinout IC packaging and the density advantage of surface mounting : Wulf H. Knausenberger and Nicholas A. Teneketges. IEEE Trans. Components Hybrids Mfg Technol.Chmt-6 (3), 298 (September 1983)

• Book ID: 103276870
• Publisher: Elsevier Science
• Year: 1984
• Tongue: English
• Weight: 132 KB
• Volume: 24
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(84)90307-x