High pinout IC packaging and the density advantage of surface mounting: Wulf H. Knausenberger and Nicholas A. Teneketges Trans. Components Hybrids Mfg Technol. Chmt-6 (3), 298 (September 1983)

• Book ID: 104157251
• Publisher: Elsevier Science
• Year: 1985
• Tongue: English
• Weight: 94 KB
• Volume: 16
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/s0026-2692(85)80030-6