High Depth Resolution SIMS Analysis with Low-energy Grazing O2+ Beams
β Scribed by Jiang, Zhi-Xiong; Alkemade, Paul F. A.; Algra, Eelke; Radelaar, S.
- Publisher
- John Wiley and Sons
- Year
- 1997
- Tongue
- English
- Weight
- 334 KB
- Volume
- 25
- Category
- Article
- ISSN
- 0142-2421
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β¦ Synopsis
By the use of a deceleration electrode in the primary beam line of a magnetic sector SIMS instrument, an O 2 primary beam of variable energy and angle has been produced. The SIMS measurements of ultrathin Ge and B layers in Si were performed with low-energy (0.7-2 keV) and grazingly incident (50-75Γ) ions. Consequently, O 2 ' ultrahigh depth resolution with characteristic exponential leading and decay lengths of 0.25 and 0.9 nm, respectively, and 1.6 nm full width at half-maximum for a Ge delta layer was obtained. A depth proΓle analysis without any appreciable loss in depth resolution was achieved down to a depth of 1 lm with a 1 keV 60Γ beam. O 2 ' Furthermore, good dynamic range, acceptable detection limit and moderate sputtering rates were achieved in this ultrahigh depth resolution mode.
1997 by John Wiley & Sons. Ltd.
π SIMILAR VOLUMES
z tr etration depth of the primary ions. In addition, the thickness of the native oxide of Si wafers was measured as a function of the storage time in air. It varied from 0.6 nm after 1 day to 1.5 nm after 2 years.