We have developed technologies which inspect the shape of solder bumps. The bumps are used to solder an LSI to a printed wiring board in high-speed workstations. The inspection system developed can measure the height, diameter, and brightness of bumps at very high speed. The bump height is measured
β¦ LIBER β¦
High accuracy microdimension measurement system by using laser and CCD
β Scribed by X.Z. Xing; M. Li; S. Ozono; J. Kato; G.R. Bai; W. Zheng; C.Q. Li
- Publisher
- Elsevier Science
- Year
- 1987
- Tongue
- English
- Weight
- 355 KB
- Volume
- 5
- Category
- Article
- ISSN
- 0263-2241
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## Abstract The MgCl~2~βsupported titanium catalyst MTK~ST~ was characterized by Xβray diffraction measurement and electron spin resonance (ESR) spectroscopy. To obtain a better understanding of the nature of active sites the process of catalyst formation was interrupted at several stages to obtain