High-speed solder bump inspection system using a laser scanner and CCD camera
✍ Scribed by Hiroyuki Tsukahara; Yoji Nishiyama; Fumiyuki Takahashi; Takashi Fuse; Toru Nishino; Moritoshi Ando
- Publisher
- John Wiley and Sons
- Year
- 2000
- Tongue
- English
- Weight
- 538 KB
- Volume
- 31
- Category
- Article
- ISSN
- 0882-1666
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✦ Synopsis
We have developed technologies which inspect the shape of solder bumps. The bumps are used to solder an LSI to a printed wiring board in high-speed workstations. The inspection system developed can measure the height, diameter, and brightness of bumps at very high speed. The bump height is measured using triangulation, in which a laser beam scans the bumps, and reflected light is detected with a position sensitive detector (PSD). The diameter and the brightness are measured using a microscope and a CCD camera. The detected results are compared with CAD data. A height measurement accuracy of r3 Pm and a diameter measurement accuracy of r5 Pm were obtained. Practical inspection systems using these techniques have been created and they can inspect 2000 bumps in 60 seconds.