Intermetallic compounds (IMCs) are present in microelectronic solder interconnects as a result of interfacial reaction between the solder and the metallization materials. Their mechanical properties are of great interest for the prediction of joint reliability of electronic packages. In this work, t
✦ LIBER ✦
Hardness, internal stress and fracture toughness of epitaxial AlxGa1−xAs films
✍ Scribed by K. Hjort; F. Ericson; J.-Å. Schweitz; C. Hallin; E. Janzén
- Publisher
- Elsevier Science
- Year
- 1994
- Tongue
- English
- Weight
- 794 KB
- Volume
- 250
- Category
- Article
- ISSN
- 0040-6090
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