This edition reflects the continued evolution of semiconductor technology, describing the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. It emphasizes the measurement of mechanical and thermal properties as well as th
Handbook of Semiconductor Interconnection Technology
โ Scribed by Geraldine Cogin Shwartz (Author)
- Publisher
- CRC Press
- Year
- 2006
- Leaves
- 533
- Edition
- 2
- Category
- Library
No coin nor oath required. For personal study only.
โฆ Synopsis
First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first ed
โฆ Table of Contents
Methods/Principles of Deposition and Etching; Geraldine Cogin Schwartz. Characterization; Geraldine Cogin Schwartz. Semiconductor Contact Technology; David R. Campbell, revised by Catherine Ivers. Interlevel Dielectrics; Geraldine Cogin Schwartz and K.V. Sriksrishnan. Metallization; Geraldine Cogin CSchwartz and K.V. Srikrishnan. Chip Integration; Geraldine Cogin Schwartz and K.V. Srikrishnan. Reliability; James R. Lloyd and Kenneth P. Rodbell. Index.
โฆ Subjects
Engineering & Technology;Electrical & Electronic Engineering;Electromagnetics & Microwaves;Electronics
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