𝔖 Bobbio Scriptorium
✦   LIBER   ✦

H^+ lithography for 3-D integration of optical circuits

✍ Scribed by Brenner, Karl-Heinz ;Frank, Michael ;Kufner, Maria ;Kufner, Stefan

Book ID
115341045
Publisher
The Optical Society
Year
1990
Tongue
English
Weight
678 KB
Volume
29
Category
Article
ISSN
1559-128X

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Test Challenges for 3D Integrated Circui
Test Challenges for 3D Integrated Circuits
✍ Lee, Hsien-Hsin; Chakrabarty, Krishnendu πŸ“‚ Article πŸ“… 2013 πŸ› Institute of Electrical and Electronics Engineers 🌐 English βš– 354 KB
Fabrication of a 3D Nanoscale Crossbar C
Fabrication of a 3D Nanoscale Crossbar Circuit by Nanotransfer-Printing Lithography
✍ Colin Stuart; Hee-Kun Park; Yong Chen πŸ“‚ Article πŸ“… 2010 πŸ› John Wiley and Sons 🌐 English βš– 469 KB

## Abstract Nanotransfer‐printing lithography simplifies the fabrication of a 3D nanoscale crossbar circuit. Gold nanowires 100 nm in width and with 100 nm spacing are printed onto a polymer layer of electrically switchable, LiClO~4~‐doped poly[2‐methoxy‐5‐(2′‐ethylhexyloxy)‐p‐phenylene vinylene] m

Electrical Modeling and Design for 3D Sy
Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Hybrid Integral Equation Modeling Methods for 3D Integration
✍ Li, Er-Ping πŸ“‚ Article πŸ“… 2012 πŸ› John Wiley & Sons, Inc. 🌐 English βš– 606 KB

**New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems** Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity a