Growth of SiC by “Hot-Wall” CVD and HTCVD
✍ Scribed by O. Kordina; C. Hallin; A. Henry; J. P. Bergman; I. Ivanov; A. Ellison; N. T. Son; E. Janzén
- Publisher
- John Wiley and Sons
- Year
- 1997
- Tongue
- English
- Weight
- 361 KB
- Volume
- 202
- Category
- Article
- ISSN
- 0370-1972
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## Abstract The model adopted for the simulation of a new industrial size type of horizontal cold wall reactor for epitaxial silicon carbide deposition is reviewed. The attention is focalized on the chemical mechanism adopted and on the comparison with some growth rate data and temperature profiles
In this study, dimethylchlorosilane diluted by hydrogen is used as the raw material, and silicon carbide crystals are grown on a silicon substrate at low temperature (< 500 °C) by the triode plasma CVD method. The plasma parameters, such as the electron temperature and the space potential in the spa