Growth and characterization of zirconium oxide thin films on silicon substrate
β Scribed by P.Y. Kuei; J.D. Chou; C.T. Huang; H.H. Ko; S.C. Su
- Publisher
- Elsevier Science
- Year
- 2011
- Tongue
- English
- Weight
- 843 KB
- Volume
- 314
- Category
- Article
- ISSN
- 0022-0248
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β¦ Synopsis
The growth and characterization of zirconium oxide (ZrO 2 ) thin films prepared by thermal oxidation of a deposited Zr metal layer on SiO 2 /Si were investigated. Uniform ZrO 2 thin film with smooth surface morphology was obtained. The thermal ZrO 2 films showed a polycrystalline structure. The dielectric constant of the ZrO 2 film has been shown to be 23, and the equivalent oxide thickness (EOT) of the ZrO 2 stacked oxide is in the range of 3.38-5.43 nm. MOS capacitors with ZrO 2 dielectric stack show extremely low leakage current density, less than 10 Γ 6 A/cm 2 at Γ 4 V. Consequently, using this method, high-quality ZrO 2 films could be fabricated at oxidation temperature as low as 600 1C.
π SIMILAR VOLUMES
Epitaxial zinc oxide thin films were grown on Si(1 1 1) using aluminum nitride and magnesium oxide/titanium nitride buffer layers. The resultant films were examined using transmission electron microscopy, X-ray diffraction, electrical conductivity, and photoluminescence spectroscopy. The following e
The silicon-rich oxide (SiO x ) films were deposited using the LPCVD (Low Pressure Chemical Vapour Deposition) method at the temperature of 570 Β°C and with silane and oxygen as the reactant gasses. The films were deposited on silicon (1 1 1) substrates. The flows of oxygen and silan in the horizonta
thermal growth of dry SiOs layers is usually described by the so-called linear parabolic equation, based on the assumption that oxygen diffusion takes place in the oxide layer according to Fick's law with constant dilfusivity, and that the oxidation occurs at the Si-Si02 interface with a first-order