Geometrical size effect on the interface diffusion of micro solder joint in electro-thermal coupling aging

✍ Scribed by Li, Xuemei; Sun, Fenglian; Liu, Yang; Zhang, Hao; Xin, Tong

• Book ID: 125362821
• Publisher: Springer US
• Year: 2014
• Tongue: English
• Weight: 785 KB
• Volume: 25
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1007/s10854-014-2084-y