Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

✍ Scribed by Iver E. Anderson; Adam Boesenberg; Joel Harringa; David Riegner; Andrew Steinmetz; David Hillman

• Publisher: Springer US
• Year: 2011
• Tongue: English
• Weight: 768 KB
• Volume: 41
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-011-1763-1