Fundamentals of Microsystems Packaging

✍ Scribed by Rao Tummala

• Publisher: McGraw-Hill Professional
• Year: 2001
• Tongue: English
• Leaves: 978
• Series: Epi
• Edition: 1
• Category: Library

✦ Synopsis

LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: Full coverage of electrical, mechanical, chemical, and materials aspects of each technology Easy-to-read schematics and block diagrams Fundamental approaches to all system issues Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes Basics of electrical and reliability testing

✦ Table of Contents

Copyright......Page 3
CONTENTS......Page 7
CHAPTER 1: INTRODUCTION TO MICROSYSTEMS PACKAGING......Page 12
1.1 WHAT ARE MICROSYSTEMS?......Page 14
1.2 MICROSYSTEM TECHNOLOGIES......Page 15
1.3 WHAT IS MICROSYSTEMS PACKAGING (MSP)?......Page 22
1.4 WHY IS MICROSYSTEMS PACKAGING IMPORTANT?......Page 30
1.5 SYSTEM-LEVEL MICROSYSTEMS TECHNOLOGIES......Page 31
1.7 SUMMARY AND FUTURE TRENDS......Page 34
1.8 WHO INVENTED MICROSYSTEMS AND PACKAGING TECHNOLOGIES?......Page 36
1.10 SUGGESTED READING......Page 51
CHAPTER 2: THE ROLE OF PACKAGING IN MICROELECTRONICS......Page 54
2.1 WHAT IS MICROELECTRONICS?......Page 56
2.2 CHARACTERISTICS OF SEMICONDUCTORS......Page 57
2.3 MICROELECTRONIC DEVICES......Page 63
2.4 INTEGRATED CIRCUITS......Page 69
2.5 IC PACKAGING......Page 75
2.6 SEMICONDUCTOR ROADMAP......Page 78
2.7 IC PACKAGING CHALLENGES......Page 83
2.8 SUMMARY AND FUTURE TRENDS......Page 84
2.9 HOMEWORK PROBLEMS......Page 87
2.10 SUGGESTED READING......Page 89
CHAPTER 3: THE ROLE OF PACKAGING IN MICROSYSTEMS......Page 90
3.2 ANATOMY OF A MICROSYSTEM......Page 92
3.3 COMPUTERS AND THE INTERNET......Page 94
3.4 WHAT IS THE ROLE OF PACKAGING IN THE COMPUTER INDUSTRY?......Page 99
3.5 WHAT IS THE ROLE OF PACKAGING IN THE TELECOMMUNICATION INDUSTRY......Page 105
3.6 WHAT IS THE ROLE OF PACKAGING IN AUTOMOTIVE SYSTEMS......Page 111
3.7 WHAT IS THE ROLE OF PACKAGING IN MEDICAL ELECTRONICS......Page 119
3.8 WHAT IS THE ROLE OF PACKAGING IN CONSUMER ELECTRONICS......Page 121
3.9 WHAT IS THE ROLE OF PACKAGING IN MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) PRODUCTS......Page 123
3.10 SUMMARY AND FUTURE TRENDS......Page 126
3.11 HOMEWORK PROBLEMS......Page 128
3.12 SUGGESTED READING......Page 129
CHAPTER 4: FUNDAMENTALS OF ELECTRICAL PACKAGE DESIGN......Page 130
4.1 WHAT IS ELECTRICAL PACKAGE DESIGN?......Page 132
4.2 FUNDAMENTALS OF ELECTRICAL PACKAGE DESIGN......Page 134
4.3 ELECTRICAL ANATOMY OF SYSTEMS PACKAGING......Page 137
4.4 SIGNAL DISTRIBUTION......Page 141
4.5 POWER DISTRIBUTION......Page 166
4.6 ELECTROMAGNETIC INTERFERENCE......Page 182
4.7 DESIGN PROCESS......Page 186
4.8 SUMMARY AND FUTURE TRENDS......Page 189
4.9 HOMEWORK PROBLEMS......Page 190
4.10 SUGGESTED READING......Page 192
CHAPTER 5: FUNDAMENTALS OF DESIGN FOR RELIABILITY......Page 194
5.2 MICROSYSTEMS FAILURES AND FAILURE MECHANISMS......Page 196
5.3 FUNDAMENTALS OF DESIGN FOR RELIABILITY......Page 197
5.4 THERMOMECHANICALLY-INDUCED FAILURES......Page 198
5.5 ELECTRICALLY-INDUCED FAILURES......Page 213
5.6 CHEMICALLY-INDUCED FAILURES......Page 216
5.7 SUMMARY AND FUTURE TRENDS......Page 218
5.8 HOMEWORK PROBLEMS......Page 219
5.9 SUGGESTED READING......Page 220
CHAPTER 6: FUNDAMENTALS OF THERMAL MANAGEMENT......Page 222
6.2 WHY THERMAL MANAGEMENT?......Page 224
6.3 COOLING REQUIREMENTS FOR MICROSYSTEMS......Page 227
6.4 THERMAL MANAGEMENT FUNDAMENTALS......Page 230
6.5 THERMAL MANAGEMENT OF IC AND PWB PACKAGES......Page 249
6.6 ELECTRONIC COOLING METHODS......Page 256
6.7 SUMMARY AND FUTURE TRENDS......Page 271
6.9 SUGGESTED READING......Page 272
CHAPTER 7: FUNDAMENTALS OF SINGLE CHIP PACKAGING......Page 274
7.1 WHAT IS A SINGLE CHIP PACKAGE?......Page 276
7.2 FUNCTIONS OF SINGLE CHIP PACKAGES......Page 277
7.3 TYPES OF SINGLE CHIP PACKAGES......Page 278
7.4 FUNDAMENTALS OF SINGLE CHIP PACKAGING......Page 281
7.5 MATERIALS, PROCESSES, AND PROPERTIES......Page 294
7.6 CHARACTERISTICS OF SINGLE CHIP PACKAGES......Page 297
7.7 SUMMARY AND FUTURE TRENDS......Page 301
7.8 HOMEWORK PROBLEMS......Page 302
7.9 SUGGESTED READING......Page 303
CHAPTER 8: FUNDAMENTALS OF MULTICHIP PACKAGING......Page 306
8.1 WHAT ARE MULTICHIP MODULES?......Page 308
8.2 MULTICHIP MODULE FUNCTIONALITY......Page 309
8.3 MULTICHIP MODULE ADVANTAGES......Page 310
8.4 MULTICHIP MODULES AT THE SYSTEM LEVEL......Page 317
8.5 TYPES OF MULTICHIP MODULE SUBSTRATES......Page 325
8.6 MULTICHIP MODULE DESIGN......Page 339
8.7 MULTICHIP MODULE TECHNOLOGY COMPARISONS......Page 343
8.8 ALTERNATIVES TO MULTICHIP MODULES......Page 345
8.9 SUMMARY AND FUTURE TRENDS......Page 346
8.11 SUGGESTED READING......Page 348
CHAPTER 9: FUNDAMENTALS OF IC ASSEMBLY......Page 352
9.1 WHAT IS IC ASSEMBLY?......Page 354
9.3 REQUIREMENTS FOR IC ASSEMBLY......Page 355
9.5 WIREBONDING......Page 356
9.6 TAPE AUTOMATED BONDING......Page 363
9.7 FLIP CHIP......Page 371
9.8 SUMMARY AND FUTURE TRENDS......Page 401
9.9 HOMEWORK PROBLEMS......Page 402
9.10 SUGGESTED READING......Page 407
CHAPTER 10: FUNDAMENTALS OF WAFER-LEVEL PACKAGING......Page 408
10.1 WHAT IS WAFER-LEVEL PACKAGING?......Page 410
10.2 WHY WAFER-LEVEL PACKAGING?......Page 411
10.3 WLP TECHNOLOGIES......Page 415
10.4 WLP RELIABILITY......Page 422
10.5 WAFER-LEVEL BURN-IN AND TEST......Page 425
10.6 SUMMARY AND FUTURE TRENDS......Page 426
10.8 SUGGESTED READING......Page 427
CHAPTER 11: FUNDAMENTALS OF PASSIVES: DISCRETE, INTEGRATED, AND EMBEDDED......Page 430
11.2 ROLE OF PASSIVE COMPONENTS IN ELECTRONIC PRODUCTS......Page 432
11.3 FUNDAMENTALS OF PASSIVE COMPONENTS......Page 436
11.4 PHYSICAL REPRESENTATIONS OF PASSIVE COMPONENTS......Page 447
11.5 DISCRETE PASSIVES......Page 450
11.6 INTEGRATED PASSIVES......Page 462
11.7 EMBEDDED (INTEGRAL) PASSIVES......Page 464
11.8 SUMMARY AND FUTURE TRENDS......Page 473
11.10 SUGGESTED READING......Page 474
CHAPTER 12: FUNDAMENTALS OF OPTOELECTRONICS......Page 476
12.2 WHY IS OPTOELECTRONICS IMPORTANT?......Page 478
12.4 ANATOMY OF AN OPTOELECTRONIC SYSTEM......Page 480
12.5 FUNDAMENTALS OF OPTOELECTRONICS......Page 481
12.6 OPTICAL INTERCONNECTION SYSTEM CONFIGURATIONS......Page 499
12.7 SUMMARY AND FUTURE TRENDS......Page 504
12.8 HOMEWORK PROBLEMS......Page 506
12.9 SUGGESTED READING......Page 508
CHAPTER 13: FUNDAMENTALS OF RF PACKAGING......Page 510
13.1 WHAT IS RF?......Page 512
13.2 RF APPLICATIONS AND MARKETS......Page 513
13.3 ANATOMY OF RF SYSTEMS......Page 514
13.4 FUNDAMENTALS OF RF......Page 523
13.5 RF PACKAGING......Page 544
13.6 RF MEASUREMENT TECHNIQUES......Page 547
13.7 SUMMARY AND FUTURE TRENDS......Page 548
13.9 SUGGESTED READING......Page 550
CHAPTER 14: FUNDAMENTALS OF MICROELECTROMECHANICAL SYSTEMS......Page 552
14.2 WHAT ARE MEMS APPLICATIONS?......Page 554
14.3 FUNDAMENTALS OF MEMS DEVICES......Page 557
14.4 TYPES OF MEMS PACKAGING SOLUTIONS......Page 570
14.5 TYPICAL MEMS DEVICES......Page 571
14.6 KEY FAILURE MECHANISMS OF MEMS......Page 575
14.7 MEMS INERTIAL SENSORS: A CASE STUDY......Page 576
14.9 HOMEWORK PROBLEMS......Page 586
14.10 SUGGESTED READING......Page 588
CHAPTER 15: FUNDAMENTALS OF SEALING AND ENCAPSULATION......Page 590
15.2 WHY IS ENCAPSULATION NECESSARY?......Page 592
15.3 FUNDAMENTALS OF ENCAPSULATION AND SEALING......Page 595
15.4 ENCAPSULATION REQUIREMENTS......Page 599
15.5 ENCAPSULANT MATERIALS......Page 603
15.6 ENCAPSULATION PROCESSES......Page 609
15.7 HERMETIC SEALING......Page 613
15.8 SUMMARY AND FUTURE TRENDS......Page 617
15.9 HOMEWORK PROBLEMS......Page 618
15.10 SUGGESTED READING......Page 619
CHAPTER 16: FUNDAMENTALS OF SYSTEM-LEVEL PWB TECHNOLOGIES......Page 622
16.1 WHAT IS A SYSTEM-LEVEL PRINTED WIRING BOARD?......Page 624
16.2 TYPES OF PRINTED WIRING BOARDS......Page 625
16.3 ANATOMY OF A PRINTED WIRING BOARD......Page 626
16.4 FUNDAMENTALS OF PRINTED WIRING BOARD......Page 628
16.5 CAD TOOLS FOR PRINTED WIRING BOARD DESIGN......Page 633
16.6 PRINTED WIRING BOARD MATERIALS......Page 638
16.7 STANDARD PRINTED WIRING BOARD FABRICATION......Page 645
16.8 LIMITATIONS IN STANDARD PRINTED WIRING BOARD PROCESS......Page 654
16.9 MICROVIA BOARDS......Page 660
16.10 PRINTED WIRING BOARD MARKET......Page 663
16.12 HOMEWORK PROBLEMS......Page 665
16.13 SUGGESTED READING......Page 666
CHAPTER 17: FUNDAMENTALS OF BOARD ASSEMBLY......Page 668
17.2 SURFACE MOUNT TECHNOLOGY......Page 670
17.3 THROUGH-HOLE ASSEMBLY......Page 693
17.4 GENERIC ASSEMBLY ISSUES......Page 698
17.6 DESIGN CHALLENGES......Page 701
17.7 SUMMARY AND FUTURE TRENDS......Page 702
17.9 SUGGESTED READING......Page 703
CHAPTER 18: FUNDAMENTALS OF PACKAGING MATERIALS AND PROCESSES......Page 704
18.1 THE ROLE OF MATERIALS IN MICROSYSTEMS PACKAGING......Page 706
18.2 PACKAGING MATERIALS AND PROPERTIES......Page 710
18.3 MATERIALS PROCESSING......Page 727
18.4 SUMMARY AND FUTURE TRENDS......Page 745
18.5 HOMEWORK PROBLEMS......Page 754
18.6 SUGGESTED READING......Page 756
CHAPTER 19: FUNDAMENTALS OF ELECTRICAL TESTING......Page 758
19.2 WHY IS ELECTRICAL TESTING NECESSARY?......Page 760
19.3 ANATOMY OF SYSTEM-LEVEL ELECTRICAL TESTING......Page 761
19.4 FUNDAMENTALS OF ELECTRICAL TESTS......Page 763
19.5 INTERCONNECTION TESTS......Page 769
19.6 ACTIVE CIRCUIT TESTING......Page 775
19.7 DESIGN FOR TESTABILITY......Page 779
19.8 SUMMARY AND FUTURE TRENDS......Page 784
19.9 HOMEWORK PROBLEMS......Page 787
19.10 SUGGESTED READING......Page 788
CHAPTER 20: FUNDAMENTALS OF PACKAGE MANUFACTURING......Page 790
20.2 GOALS OF MANUFACTURING......Page 792
20.3 FUNDAMENTALS OF MANUFACTURING......Page 793
20.4 STATISTICAL FUNDAMENTALS......Page 795
20.5 PROCESS CONTROL......Page 813
20.6 STATISTICAL EXPERIMENTAL DESIGN......Page 824
20.7 PROCESS MODELING......Page 835
20.8 YIELD MODELING......Page 841
20.9 CIM SYSTEMS......Page 849
20.10 SUMMARY AND FUTURE TRENDS......Page 850
20.11 HOMEWORK PROBLEMS......Page 851
20.12 SUGGESTED READING......Page 854
CHAPTER 21: FUNDAMENTALS OF MICROSYSTEMS DESIGN FOR ENVIRONMENT......Page 856
21.1 WHAT ARE THE ENVIRONMENTAL CONCERNS OF MICROSYSTEMS?......Page 858
21.2 HOW ELECTRONICS PRODUCTION INFLUENCES THE ENVIRONMENT......Page 861
21.3 LIFE-CYCLE ASSESSMENT......Page 878
21.4 SUMMARY AND FUTURE TRENDS......Page 884
21.6 SUGGESTED READING......Page 886
CHAPTER 22: FUNDAMENTALS OF MICROSYSTEMS RELIABILITY......Page 888
22.2 FUNDAMENTALS OF THERMOMECHANICAL RELIABILITY......Page 890
22.3 WHY IS RELIABILITY IMPORTANT?......Page 893
22.4 RELIABILITY METROLOGY......Page 895
22.5 FAILURE MODES AND MECHANISMS......Page 899
22.6 RELIABILITY QUALIFICATIONS......Page 906
22.7 THERMOMECHANICAL FAILURE ANALYSIS......Page 907
22.8 EXPERIMENTAL METHODS AND TOOLS FOR RELIABILITY ANALYSIS......Page 912
22.9 INTEGRATED VIRTUAL RELIABILITY PREDICTION......Page 928
22.10 SUMMARY AND FUTURE TRENDS......Page 929
22.11 HOMEWORK PROBLEMS......Page 931
22.12 SUGGESTED READING......Page 933
GLOSSARY......Page 934
APPENDICES......Page 955
INDEX......Page 965