The only book to teach microsystems packaging-written by the field's leading authorThis is the book that engineers, technicians, and students want-the first to teach microsystems packaging from the ground up. Rao Tummala's one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It's the only book to do so. This much-needed tool features:A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technologyEasy-to-read schematics and block diagramsFundamental approaches to all system issuesExamples of all common configurations and technologies-wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and othersDetails on chip-to-board connections, sealing and encapsulation, and manufacturing processesBasics of electrical and reliability testingHundreds of explanatory two-color illustrationsSelf-test problems and solutions in every chapterGlossary*The best way to learn microsystems packaging through self-study or in a classroom-and the most comprehensive on-the-job reference