Fundamentals of microsystems packaging

✍ Scribed by Tummala, Rao R

Publisher: McGraw-Hill Professional
Year: 2001
Tongue: English
Leaves: 870
Edition: I.S.ed
Category: Library

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✦ Synopsis

From the cover: The only book to teach microsystems packaging written by the field's leading author

✦ Table of Contents

Content: Introduction to microsystems packaging --
Role of packaging in microelectroncis --
Role of packaging in microsystems --
Fundamentals of electrical package design --
Fundamentals of design for reliability --
Fundamentals of thermal management --
Fundamentals of single chip packaging --
Fundamentals of multichip packaging --
Fundamentals of IC assembly --
Fundamentals of wafer-level packaging --
Fundamentals of passives: discrete, integrated, and embedded --
Fundamentals of optoelectronics --
Fundamentals of RF packaging --
Fundamentals of microelectromechanical systems --
Fundamentals of sealing and encapsulation --
Fundamentals of system-level PWB technologies --
Fundamentals of board assembly --
Fundamentals of packaging materials and processes --
Fundamentals of electrical testing --
Fundamentals of packaging manufacturing --
Fundamentals of microsystems design for environment --
Fundamentals of microsystems reliability.

✦ Subjects

Electronic packaging;Handbooks, manuals, etc.;Microelectronic packaging;Handbooks, manuals, etc.;Miniature electronic equipment;Packaging;Handbooks, manuals, etc.;Mikrosystemtechnik.

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