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Fracture strength and biaxial modulus measurement of plasma silicon nitride films

โœ Scribed by G.F. Cardinale; R.W. Tustison

Publisher
Elsevier Science
Year
1992
Tongue
English
Weight
386 KB
Volume
207
Category
Article
ISSN
0040-6090

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Youngโ€™s modulus and interlaminar fractur
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โœ Shun-Fa Hwang; Jia-Hong Yu; Bau-Jang Lai; Hsien-Kuang Liu ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 716 KB

SU-8 cantilever beams deposited on the polished sides or unpolished sides of silicon wafers were fabricated by MEMS and bulk micro-machining techniques. Bending tests were conducted to measure the Young's modulus and interface fracture toughness. The results indicate that the Young's modulus is incr