Force Sensors for Microelectronic Packaging Applications

✍ Scribed by Dr. Jürg Schwizer, Professor Dr. Michael Mayer, Professor Dr. Oliver Brand (auth.)

• Publisher: Springer-Verlag Berlin Heidelberg
• Year: 2005
• Tongue: English
• Leaves: 183
• Series: Microtechnology and MEMS
• Edition: 1
• Category: Library

✦ Synopsis

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

✦ Table of Contents

Introduction....Pages 1-11
Sensor Design....Pages 13-48
Measurement System....Pages 49-66
Characterization....Pages 67-92
Applications....Pages 93-158
Conclusions and Outlook....Pages 159-160

✦ Subjects

Nanotechnology; Optical and Electronic Materials; Physics and Applied Physics in Engineering; Quality Control, Reliability, Safety and Risk; Electronics and Microelectronics, Instrumentation