3D Microelectronic Packaging: From Architectures to Applications

✍ Scribed by Yan Li, Deepak Goyal

• Publisher: Springer Singapore;Springer
• Year: 2021
• Tongue: English
• Leaves: 629
• Series: Springer Series in Advanced Microelectronics 64
• Edition: 2nd ed.
• Category: Library

✦ Synopsis

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

✦ Table of Contents

Front Matter ....Pages i-xvii
Introduction to 3D Microelectronic Packaging (Yan Li, Deepak Goyal)....Pages 1-16
3D Packaging Architectures and Assembly Process Design (Ravi Mahajan, Bob Sankman)....Pages 17-45
Materials and Processing of TSV (Praveen Kumar, Indranath Dutta, Zhiheng Huang, Paul Conway)....Pages 47-70
Microstructure and Mechanical Reliability Issues of TSV (Praveen Kumar, Tae-Kyu Lee, Indranath Dutta, Zhiheng Huang, Paul Conway)....Pages 71-105
Phase-Field-Crystal Model: A Tool for Probing Atoms in TSV (Jinxin Liu, Zhiheng Huang, Paul Conway, Yang Liu)....Pages 107-130
Atomic Scale Kinetics of TSV Protrusion (Jinxin Liu, Zhiheng Huang, Paul Conway, Yang Liu)....Pages 131-155
Fundamentals and Failures in Die Preparation for 3D Packaging (Huan Ma, Hualiang Shi, Erasenthiran Poonjolai)....Pages 157-199
Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D Packaging (Tadatomo Suga, Ran He, George Vakanas, Antonio La Manna)....Pages 201-231
Copper Micro and Nano Particles Mixture for 3D Interconnection Application (Yuanyuan Dai, Chuan Seng Tan)....Pages 233-258
Fundamentals of Bonding Technology and Process Materials for 2.5/3D Packages (Sangil Lee)....Pages 259-328
Fundamentals of Solder Alloys in 3D Packaging (Kwang-Lung Lin)....Pages 329-346
Fundamentals of Electromigration in Interconnects of 3D Packaging (Pilin Liu)....Pages 347-367
Fundamentals of Heat Dissipation in 3D IC Packaging and Thermal-Aware Design (Satish G. Kandlikar, Amlan Ganguly)....Pages 369-395
Fundamentals of Advanced Materials and Processes in Organic Substrate Technology (Songhua Shi, Peter Tortorici, Sai Vadlamani, Prithwish Chatterjee)....Pages 397-429
Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization (Liangbiao Chen, Tengfei Jiang, Xuejun Fan)....Pages 431-469
Processing and Reliability of Solder Interconnections in Stacked Packaging (Paul Vianco, Mike Neilsen)....Pages 471-526
Interconnect Quality and Reliability of 3D Packaging (Yaodong Wang, Yingxia Liu, Menglu Li, K. N. Tu, Luhua Xu)....Pages 527-573
Fault Isolation and Failure Analysis of 3D Packaging (Yan Li, Deepak Goyal)....Pages 575-617
Back Matter ....Pages 619-622

✦ Subjects

Physics; Electronic Circuits and Devices; Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Microengineering; Nanotechnology and Microengineering; Metallic Materials