3D Microelectronic Packaging: From Fundamentals to Applications

✍ Scribed by Yan Li, Deepak Goyal (eds.)

• Publisher: Springer International Publishing
• Year: 2017
• Tongue: English
• Leaves: 465
• Series: Springer Series in Advanced Microelectronics 57
• Edition: 1
• Category: Library

✦ Synopsis

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

✦ Table of Contents

Front Matter....Pages i-ix
Introduction to 3D Microelectronic Packaging....Pages 1-15
3D Packaging Architectures and Assembly Process Design....Pages 17-46
Materials and Processing of TSV....Pages 47-69
Microstructural and Reliability Issues of TSV....Pages 71-99
Fundamentals and Failures in Die Preparation for 3D Packaging....Pages 101-128
Direct Cu to Cu Bonding and Other Alternative Bonding Techniques in 3D Packaging....Pages 129-155
Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages....Pages 157-203
Fundamentals of Solder Alloys in 3D Packaging....Pages 205-222
Fundamentals of Electromigration in Interconnects of 3D Packaging....Pages 223-244
Fundamentals of Heat Dissipation in 3D IC Packaging....Pages 245-260
Fundamentals of Advanced Materials and Processes in Organic Substrate Technology....Pages 261-291
Die and Package Level Thermal and Thermal/Moisture Stresses in 3D Packaging: Modeling and Characterization....Pages 293-332
Processing and Reliability of Solder Interconnections in Stacked Packaging....Pages 333-373
Interconnect Quality and Reliability of 3D Packaging....Pages 375-420
Fault Isolation and Failure Analysis of 3D Packaging....Pages 421-459
Back Matter....Pages 461-463

✦ Subjects

Electronics and Microelectronics, Instrumentation;Optical and Electronic Materials;Electronic Circuits and Devices;Microengineering;Nanotechnology and Microengineering;Metallic Materials