𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Flow Simulation for Chemical Mechanical Planarization

✍ Scribed by Fu, Ming-Nan; Chou, Fu-Chu


Book ID
111672136
Publisher
Institute of Pure and Applied Physics
Year
1999
Tongue
English
Weight
222 KB
Volume
38
Category
Article
ISSN
0021-4922

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES


SiLK dielectric planarization by chemica
✍ F KΓΌchenmeister; U Schubert; C Wenzel πŸ“‚ Article πŸ“… 2000 πŸ› Elsevier Science 🌐 English βš– 619 KB

As the feature size of integrated circuits is driven to smaller dimensions the importance of the inter-and intralayer isolator capacitance in future metallization schemes becomes more pronounced. Organic polymers with low dielectric constants are one class of material choice for the replacement of S