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Film-thickness considerations in microcantilever-beam test in measuring mechanical properties of metal thin film

โœ Scribed by Dongil Son; Jeung-hyun Jeong; Dongil Kwon

Book ID
108388702
Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
597 KB
Volume
437
Category
Article
ISSN
0040-6090

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New methods for measuring mechanical properties of thin films in micromachining: Beam pull-in voltage (VPI) method and long beam deflection (LBD) method
โœ Quanbo Zou; Zhijian Li; Litian Liu ๐Ÿ“‚ Article ๐Ÿ“… 1995 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 506 KB

New stress-measurement methods for determining both tensile and compressive stress and Young's modulus in surface micromachining are presented. The investigation is concentrated on the development of two techniques: (1) beam pull-in voltage \(\left(V_{\mathrm{PI}}\right)\) and (2) long beam deflecti