๐”– Bobbio Scriptorium
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Fatigue life of leadless chip carrier solder joints during power cycling: Werner Engelmaier IEEE Trans. Components Hybrids Mfg Technol. Chmt-6 (3), 232 (September 1983)


Book ID
104157250
Publisher
Elsevier Science
Year
1985
Tongue
English
Weight
94 KB
Volume
16
Category
Article
ISSN
0026-2692

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๐Ÿ“œ SIMILAR VOLUMES


The effect of high dissipation component
๐Ÿ“‚ Article ๐Ÿ“… 1985 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 94 KB

An analytical method is described which provides estimates to first ordel of the number of either power or environmental cycle's leading to solder joint failure. Various parameter variations such as solder joint height, ceramic chip carrier (CCC) size, printed circuit substrate (PCS) material, etc.