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The effect of joint design on the thermal fatigue life of leadless chip carrier solder joints : William M. Sherry, James S. Erich, Michael K. Bartschat and Friedrich B. Prinz. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-8 (4), 417 (1985)


Publisher
Elsevier Science
Year
1987
Tongue
English
Weight
135 KB
Volume
27
Category
Article
ISSN
0026-2714

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