Fatigue crack growth tests of lead-contained (Sn-37Pb) and lead-free (Sn-3.0Ag-0.5Cu) solders were conducted under frequencies ranged from 10 to 0.1 Hz and a stress ratio of 0.1 at room temperature and 70ο°C. J-integral range (οJ) and modified J-integral (C οͺ ) were used for discussing about cycle-de
β¦ LIBER β¦
Fatigue behavior of rigid polymeric materials and composites at room and elevated temperature
β Scribed by Harumi Furue; Shoji Shimamura
- Book ID
- 105519577
- Publisher
- Springer Netherlands
- Year
- 1980
- Tongue
- English
- Weight
- 506 KB
- Volume
- 16
- Category
- Article
- ISSN
- 1573-2673
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