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Fabrication of SiC p /Cu–Al electronic packaging material by pressureless infiltration method

✍ Scribed by Yang, L; Zhang, M

Book ID: 126891684
Publisher: Institute of Materials, Minerals and Mining
Year: 2013
Tongue: English
Weight: 252 KB
Volume: 29
Category: Article
ISSN: 0267-0836
DOI: 10.1179/1743284712y.0000000152

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