Al–SiC ELECTRONIC PACKAGES WITH CONTROLLED THERMAL EXPANSION COEFFICIENT BY A NEW METHOD OF PRESSURELESS INFILTRATION

✍ Scribed by Hemambar, Ch.; Rao, B. Srinivasa; Jayaram, V.

• Book ID: 126051950
• Publisher: Taylor and Francis Group
• Year: 2001
• Tongue: English
• Weight: 709 KB
• Volume: 16
• Category: Article
• ISSN: 1042-6914
• DOI: 10.1081/AMP-100108698