Fabrication of Electronic Packaging Grade Cu–W Materials by High-Temperature and High-Velocity Compaction

✍ Scribed by Guosheng Jiang; Zhifa Wang; Yi Gu; Qiwang Zhang; Yong Gao; Ken Kuang

• Book ID: 117913337
• Publisher: Institute of Electrical and Electronics Engineers
• Year: 2012
• Tongue: English
• Weight: 559 KB
• Volume: 2
• Category: Article
• ISSN: 2156-3950
• DOI: 10.1109/tcpmt.2011.2178243