๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Fabrication of an electronic package box of SiCP/Al composites with high volume SiCP

โœ Scribed by Chu, Ke ;Jia, Chengchang ;Yin, Fazhang ;Mei, Xuezhen ;Qu, Xuanhui

Book ID
107476170
Publisher
Higher Education Press and Springer
Year
2007
Tongue
English
Weight
287 KB
Volume
1
Category
Article
ISSN
1673-7377

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Thermal conductive properties of Niโ€“P el
Thermal conductive properties of Niโ€“P electroless plated SiCp/Al composite electronic packaging material
โœ H.F. Zhao; W.Z. Tang; C.M. Li; G.C. Chen; F.X. Lu; Y.H. Cai; H. Guo; R.Q. Zhang; ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 783 KB

Electroless plated SiC p /Al composites with a high thermal conductivity are required for electronic packaging application. In this paper, in-plane thermal conductive properties of SiC p /Al composites with and without electroless plated Ni-P coatings are compared, and influence of various character