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Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites

✍ Scribed by Kai-kun WANG; Fu-yu WANG; Xue-jun CHEN; Lu WANG; Chun-mei MA

Book ID: 117694088
Publisher: Elsevier Science
Year: 2010
Tongue: English
Weight: 618 KB
Volume: 20
Category: Article
ISSN: 1003-6326
DOI: 10.1016/s1003-6326(09)60362-9

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