Evolution of Microstructure Across Eutectic Sn-Bi Solder Joints Under Simultaneous Thermal Cycling and Current Stressing

✍ Scribed by Zuo, Yong; Ma, Limin; Liu, Sihan; Shu, Yutian; Guo, Fu

• Book ID: 121565118
• Publisher: Springer US
• Year: 2014
• Tongue: English
• Weight: 930 KB
• Volume: 44
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-013-2972-6