✦ LIBER ✦
Effects of Copper Doping on Microstructural Evolution in Eutectic SnBi Solder Stripes under Annealing and Current Stressing
✍ Scribed by Chih-Ming Chen; Chih-Chieh Huang; Chien-Neng Liao; Kuen-Ming Liou
- Book ID
- 107453898
- Publisher
- Springer US
- Year
- 2007
- Tongue
- English
- Weight
- 495 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0361-5235
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