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Evaluation of mechanical stresses in silicon substrates due to lead–tin solder bumps via synchrotron X-ray topography and finite element modeling

✍ Scribed by J. Kanatharana; J.J. Pérez-Camacho; T. Buckley; P.J. McNally; T. Tuomi; A.N. Danilewsky; M. O’Hare; D. Lowney; W. Chen; R. Rantamäki; L. Knuuttila; J. Riikonen

Book ID: 108411249
Publisher: Elsevier Science
Year: 2003
Tongue: English
Weight: 978 KB
Volume: 65
Category: Article
ISSN: 0167-9317
DOI: 10.1016/s0167-9317(02)00852-3

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