The evaluation of mechanical stresses developed in underlying silicon substrates due to electroless nickel under bump metallization using synchrotron X-ray topography

✍ Scribed by D. Noonan; P.J. McNally; W.-M. Chen; A. Lankinen; L. Knuuttila; T.O. Tuomi; A.N. Danilewsky; R. Simon

• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 357 KB
• Volume: 37
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/j.mejo.2006.06.008