Examination of mechanical stresses in silicon substrates due to lead tin solder bumps via micro-Raman spectroscopy and finite element modelling

✍ Scribed by Kanatharana, J; P rez-Camacho, J J; Buckley, T; McNally, P J; Tuomi, T; Riikonen, J; Danilewsky, A N; O Hare, M; Lowney, D; Chen, W; Rantam ki, R; Knuuttila, L

• Book ID: 120463568
• Publisher: Institute of Physics
• Year: 2002
• Tongue: English
• Weight: 453 KB
• Volume: 17
• Category: Article
• ISSN: 0268-1242
• DOI: 10.1088/0268-1242/17/12/308