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Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials

✍ Scribed by T.Y. Lin; C.N. Liao; Albert T. Wu

Book ID: 107457366
Publisher: Springer US
Year: 2011
Tongue: English
Weight: 602 KB
Volume: 41
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-011-1740-8

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