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Correlation between thermal diffusivity and activation energy of ordering of lead free solder alloys Sn65−xAg25Sb10Cuxrapidly solidified from molten state

✍ Scribed by R. M. Shalaby


Book ID
106397319
Publisher
Springer US
Year
2005
Tongue
English
Weight
251 KB
Volume
16
Category
Article
ISSN
0957-4522

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