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Enhancement of flip-chip fatigue life by encapsulation

✍ Scribed by Suryanarayana, D.; Hsiao, R.; Gall, T.P.; McCreary, J.M.

Book ID: 114560552
Publisher: IEEE
Year: 1991
Tongue: English
Weight: 918 KB
Volume: 14
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.76536

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