𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Resin flow characteristics of underfill process on flip chip encapsulation

✍ Scribed by Y.K. Shen; C.M. Ju; Y.J. Shie; H.W. Chien

Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
619 KB
Volume
31
Category
Article
ISSN
0735-1933

No coin nor oath required. For personal study only.

✦ Synopsis

Flip chip package is the most important technology in IC package for the necessary of scale, velocity and cost by the development of semiconductor technology and the innovation of computer product. This paper indicates that the analysis for flow visualization of the solder ball and chip between numerical simulation and experiment. A finite element simulation of moving boundaries in a three-dimensional inertia-free, incompressible flow is presented. The injection situation uses for one line injection, (L) line injection, (U) line injection and central point injection location. The injection process uses for different parameters (mold temperature, injection temperature, injection pressure, injection time). The results show that the filling situation for numerical simulation is closer to experiment.

(c) 2004 Elsevier Science Ltd

📜 SIMILAR VOLUMES

Study on flow visualization of flip chip
Study on flow visualization of flip chip encapsulation process for numerical simulation
✍ Yung-Kang Shen; Shiau-Tsuen Huang; Ching-Jung Chen; Shan Yu 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 478 KB

Flip chip package is the most important technology in IC package necessary for scale, velocity and cost by the development of semiconductor technology and the innovation of computer product. It has the advantages of low cost, low interface and small volume in IC package. This paper emphasizes the an

Study on the Curing Process and the Gela
Study on the Curing Process and the Gelation of Epoxy/Anhydride System for No-Flow Underfill for Flip-Chip Applications
✍ Zhuqing Zhang; Erin Beatty; C. P. Wong 📂 Article 📅 2003 🏛 John Wiley and Sons 🌐 English ⚖ 250 KB

## Abstract No‐flow underfill is used in the assembly of microelectronics to increase the productivity and to decrease the cost of the flip‐chip manufacturing. The curing process, especially the gelation of the no‐flow underfill, is essential for the yield and reliability of the flip‐chip assembly.