Encapsulant for fatigue life enhancement of controlled-collapse chip connection (C4)

✍ Scribed by Wang, D.W.; Papathomas, K.I.

• Book ID: 114560505
• Publisher: IEEE
• Year: 1993
• Tongue: English
• Weight: 480 KB
• Volume: 16
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.273686