β Scribed by Joseph S. Heyman, Joseph S. Heyman
No coin nor oath required. For personal study only.
This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
ELECTRONICS RELIABILITY AND MEASUREMENT TECHNOLOGY......Page 2
Foreword......Page 6
Preface......Page 8
Contents and Subject Index......Page 10
EXECUTIVE SUMMARY OF FINDINGS AND RECOMMENDATIONS......Page 14
MEASUREMENT SCIENCE AND MANUFACTURING SCIENCE RESEARCH......Page 20
NONDESTRUCTIVE SEM FOR SURFACE AND SUBSURFACE WAFER IMAGING......Page 30
SENSORS DEVELOPED FOR IN-PROCESS THERMAL SENSING AND IMAGING......Page 50
WAFER LEVEL RELIABILITY FOR HIGH-PERFORMANCE VLSI DESIGN......Page 55
WAFER LEVEL RELIABILITY TESTING: AN IDEA WHOSE TIME HAS COME......Page 68
MICRO-FOCUS X-RAY IMAGING......Page 73
MEASUREMENT OF OPAQUE FILM THICKNESS......Page 81
INTELLIGENT LASER SOLDERING INSPECTION AND PROCESS CONTROL......Page 92
RUPTURE TESTING FOR THE QUALITY CONTROL OF ELECTRODEPOSITED COPPER INTERCONNECTIONS IN HIGH-SPEED, HIGHΒ·DENSITY CIRCUITS......Page 102
HETERODYNE HOLOGRAPHIC INTERFEROMETRY: HIGH-RESOLUTION RANGING AND DISPLACEMENT MEASUREIVIEI\lT......Page 120
"WHOLE WAFER" SCANNING ELECTRON MICROSCOPY......Page 136
Other Noyes Publications......Page 142
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This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
Content: <br>Foreword</span></a></h3>, <i>Page v</i><br>Preface</span></a></h3>, <i>Pages vii-viii</i>, Joseph A. Heyman<br>- Executive summary of findings and recommendations</span></a></h3>, <i>Pages 1-6</i><br>Measurement science and manufacturing science research</span></a></h3>, <i>Pages 7-16</
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