β Scribed by Joseph S. Heyman (Eds.)
No coin nor oath required. For personal study only.
Content:
Foreword, Page v
Preface, Pages vii-viii, Joseph A. Heyman
- Executive summary of findings and recommendations, Pages 1-6
Measurement science and manufacturing science research, Pages 7-16, D. Howard Phillips
Nondestructive SEM for surface and subsurface wafer imaging, Pages 17-33, Roy H. Propst, C. Robert Bagnell, Edward I. Cole Jr., Brian G. Davies, Frank A. DiBianca, Darryl G. Johnson, William V. Oxford, Craig A. Smith
Surface inspection-research and development, Pages 34-36, J.S. Batchelder
- Sensors developed for in-process thermal sensing and imaging, Pages 37-41, I.H. Choi, K.D. Wise
Wafer level reliability for high-performance VLSI design, Pages 42-54, Bryan J. Root, James D. Seefeldt
Wafer level reliability testing: An idea whose time has come, Pages 55-59, O.D. Trapp
Micro-focus X-ray imaging, Pages 60-67, Michael Juha
Measurement of opaque film thickness, Pages 68-78, R.L. Thomas, J. Jaarin, C. Reyes, I.C. Oppenheim, L.D. Favro, P.K. Kuo
Intelligent laser soldering inspection and process control, Pages 79-88, Riccardo Vanzetti
Rupture testing for the quality control of electrodeposited copper interconnections in high-speed, high-density circuits, Pages 89-106, Louis Zakraysek
- Heterodyne holographic interferometry: High-resolution ranging and displacement measurement, Pages 107-122, James W. Wagner
- βWhole waferβ scanning electron microscopy, Pages 123-128, J. Devaney
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