Electronics Reliability and Measurement Technology - Nondestructive Evaluation

✍ Scribed by Heyman, J.S.

• Publisher: William Andrew Publishing/Noyes
• Year: 1988
• Tongue: English
• Leaves: 130
• Category: Library

✦ Synopsis

This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.

✦ Table of Contents

Content:
Front Matter
• Preface
• Table of Contents
1. Executive Summary of Findings and Recommendations
2. Measurement Science and Manufacturing Science Research
3. Nondestructive SEM for Surface and Subsurface Wafer Imaging
4. Surface Inspection - Research and Development
5. Sensors Developed for In-Process Thermal Sensing and Imaging
6. Wafer Level Reliability for High-Performance VLSI Design
7. Wafer Level Reliability Testing: An Idea Whose Time Has Come
8. Micro-Focus X-ray Imaging
9. Measurement of Opaque Film Thickness
10. Intelligent Laser Soldering Inspection and Process Control
11. Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits
12. Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement
13. “Whole Wafer” Scanning Electron Microscopy
• Back Matter