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Electromigration effects on intermetallic growth at wire-bond interfaces

✍ Scribed by H. T. Orchard; A. L. Greer

Book ID: 107453808
Publisher: Springer US
Year: 2006
Tongue: English
Weight: 211 KB
Volume: 35
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-006-0300-0

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