Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization

✍ Scribed by Hui Xu; Changqing Liu; Vadim V. Silberschmidt; Zhong Chen

• Book ID: 107455650
• Publisher: Springer US
• Year: 2009
• Tongue: English
• Weight: 502 KB
• Volume: 39
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-009-0951-8